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VIA Declares Ultra Compact, Fanless VIA AMOS-3002 System

Delivers energy effective dual-core handling in a ruggedized case program for a varied variety of included applications
VIA Technological innovation, Inc, a major head of energy effective handling systems, today declared the VIA AMOS-3002, an ultra compact, fanless program developed around the tiny VIA EPIA-P900 Pico-ITX panel. The VIA AMOS-3002 provides included customers with a program that provides all the additional features and electronic press requirements required for a varied variety of included programs such as telematics, in-vehicle control, device to device operator (M2M), electronic signs and kiosks.


Leveraging the electronic expertise of the put together 1.0GHz VIA EdenTM X2 dual-core brand and the VIA VX900H press program brand (MSP) on the VIA EPIA-P900 panel, the VIA AMOS-3002 provides a highly effective, strong and HD-ready industrial-class PC that includes all the benefits of highly effective 64-bit handling in an ultra compact program. The highly incorporated, all-in-one VIA VX900H features callous components speed of the most strenuous codecs, such as MPEG-2, WMV9 and H.264, in solutions up to 1080p across the newest show connection requirements, such as local HDMI assistance, for next technology multimedia-intensive programs.

"The VIA AMOS-3002 developments the ultra compact AMOS sequence systems, providing fanless dual-core handling and innovative press abilities," said Epan Wu, Head of the VIA Embedded Foundation Department, VIA Technological innovation, Inc. "The excellent adaptability and efficient compact design of the VIA AMOS-3002 makes it ideal for a varied variety of included programs."

VIA AMOS-3002

The VIA AMOS-3002 is created to assist the VIA EPIA-P900 Pico-ITX panel, which includes a 1.0GHz EdenTM X2 brand and the VIA VX900H MSP, to work completely fanlessly within a solid case calculating 19.7cm x 10.4cm x 4.9cm (WxDxH). The VIA AMOS-3002 has a qualified managing heat range of -20 to 60 levels C, shake threshold of up to 5Grms and a impact threshold of up to 50G. The VIA AMOS-3002 is also available with the VIA EPIA-P830 presenting a 1.0GHz New ipod nano E-Series brand, providing an managing heat range of -20 to 70 levels C.

Storage is provided through a Cfast position for a SATA program Memory stick while an optionally available storage space sub-system development case provides assistance for a standard 2.5" SATA generate. Complete I/O features on front and back sections include two COM slots, six USB 2.0 slots, such as two of which are locking for improved ruggedization, line-in/out, one DIO slot, one VGA and one HDMI slot for show connection and two GLAN slots for put together Gigabit marketing. Optional Wi-Fi and 3G marketing are available through a MiniPCIe development position.

For more information about the VIA AMOS-3002, please visit:
http://www.viaembedded.com/en/products/systems/productDetail.jsp?productLine=2&id=1870&tabs=1

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